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HANA MICRON INC

Overview
  • Total Patents
    225
  • GoodIP Patent Rank
    17,473
  • Filing trend
    ⇩ 69.0%
About

HANA MICRON INC has a total of 225 patent applications. It decreased the IP activity by 69.0%. Its first patent ever was published in 2003. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets semiconductors, computer technology and audio-visual technology are NANOPIERCE TECHNOLOGIES INC, SHANGHAI DAOZHI TECH CO LTD and UTAC TAIWAN CORP.

Patent filings per year

Chart showing HANA MICRON INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jeong Jin Wook 37
#2 Kim Hyun Joo 36
#3 Lim Jae Sung 33
#4 Kim Dong Hyun 15
#5 Lim Jae-Sung 15
#6 Kim Ju Hyung 15
#7 Lee Hyun Woo 15
#8 Yeum Sang Yeul 12
#9 Lee Hyouk 12
#10 Jang Cheol Ho 11

Latest patents

Publication Filing date Title
KR20210012778A Vertical Cavity Surface Emitting Laser Module
KR20200118667A Image sensor package, modul and fabricating method thereof
KR20190140258A gas sensor package, gas sensor wafer level package, and the method for manufacturing the same
KR20190107455A Semiconductor device and wafer level package having redistribution structure, and method for manufacturing the same
KR20190046082A Fingerprint sensor package and manufacturing method thereof
WO2018066857A1 Fingerprint sensor package, and fingerprint sensor card and fingerprint sensor module each including same
KR101948118B1 Semiconductor package and manufacturing method thereof
KR20180038971A Fingerprint sensor package and fingerprint sensor card and fingerprint sensor module comprising the same
WO2018026132A1 Fingerprint sensor package and fingerprint sensor module including same
US2018307876A1 RFID reader
KR20180116918A Semiconductor package comprising electrostatic discharge and impact protecting structure
WO2018026078A1 Fingerprint sensor package and fingerprint sensor module including same
KR20180016239A Fingerprint sensor package and fingerprint sensor module comprising the same
US2018358288A1 Metal core solder ball interconnector fan-out wafer level package
KR20180013120A Electronic Apparatus and Method for Identifying Location of Movable Object
KR20180013117A Antenna and Manufacturing Method having Directivity Radiation Pattern
KR20170129554A Camera module of image sensor united with barrel
KR20170096872A Device for flexible track pad semiconductor package having sensor PCB of smart phone and method for manufacturing the same
KR20170096873A Device for flexible track pad semiconductor package of smart phone and method for manufacturing the same
KR101741648B1 Semiconductor package having electromagnetic waves shielding means, and method for manufacturing the same