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SMIC INTEGRATED CIRCUIT NINGBO CO LTD

Overview
  • Total Patents
    100
  • GoodIP Patent Rank
    14,352
  • Filing trend
    ⇧ 3750.0%
About

SMIC INTEGRATED CIRCUIT NINGBO CO LTD has a total of 100 patent applications. It increased the IP activity by 3750.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and micro-structure and nano-technology are OPTOPAC INC, KOYANAGI MITSUMASA and GRAPHIC TECHNO JAPAN CO LTD.

Patent filings in countries

World map showing SMIC INTEGRATED CIRCUIT NINGBO CO LTDs patent filings in countries
# Country Total Patents
#1 China 100

Patent filings per year

Chart showing SMIC INTEGRATED CIRCUIT NINGBO CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Luo Hailong 24
#2 Qin Xiaoshan 21
#3 Clive De Bortoli 15
#4 Liu Mengbin 13
#5 Chen Da 12
#6 Shi Hu 7
#7 Li Haijiang 4
#8 Ao Saren 4
#9 Yang Tianlun 4
#10 Yang Weicheng 4

Latest patents

Publication Filing date Title
CN111682380A Electrical connection structure and forming method thereof
CN111627891A Semiconductor structure and chip packaging method
CN111581621A Data security processing method, device, system and storage medium
CN111048426A Manufacturing method of electromagnetic shielding structure
CN111106045A Semiconductor structure, processing method thereof and etching machine
CN111009542A Packaging method and packaging structure
CN111048465A Lifting device for bearing wafer
CN111081562A Chip packaging method and chip packaging structure
CN110783327A Wafer level system packaging method and packaging structure
CN110640324A Wafer double-side manufacturing system
CN110404860A A kind of use in waste water treatment probe cleaning method and device
CN110379721A Fan-out package method and encapsulating structure
CN110379767A The method of wafer-level packaging chip through-hole interconnection and the test method of chip
CN111755319A Wafer cleaning method and photoresist patterning method
CN111744836A Wafer cleaning device and control system
CN111627940A CMOS image sensor packaging module, forming method thereof and camera device
CN111627939A CMOS image sensor packaging module, forming method thereof and camera device
CN111627941A CMOS image sensor packaging module, forming method thereof and camera device
CN111524849A Semiconductor structure and manufacturing method thereof
CN111524918A Camera shooting assembly and packaging method thereof, lens module and electronic equipment