| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 11 | |
| #2 | Singapore | 4 | |
| #3 | United States | 4 | |
| #4 | United Kingdom | 3 | |
| #5 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Semiconductors | |
| #3 | Audio-visual technology | |
| #4 | Machine tools | |
| #5 | Chemical engineering | |
| #6 | Packaging and shipping | |
| #7 | Measurement | |
| #8 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Shaping of plastics | |
| #3 | Casings and printed circuits | |
| #4 | Unspecified technologies | |
| #5 | Presses | |
| #6 | Transport or storage devices | |
| #7 | Cleaning | |
| #8 | Measuring electric variables | |
| #9 | Soldering, welding and flame cutting | |
| #10 | Refrigerators |
| # | Name | Total Patents |
|---|---|---|
| #1 | Chen Qiong | 2 |
| #2 | Lian Tiang Siong | 2 |
| #3 | Liou Di-Fu | 2 |
| #4 | Siong Lian Tiang | 2 |
| #5 | Hornisch Frank | 2 |
| #6 | Tay Huck Wee | 2 |
| #7 | Lu Yongfeng | 1 |
| #8 | Sim Yak Hui | 1 |
| #9 | Cheng Qiong | 1 |
| #10 | Choy Tan H | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW422767B | Mold for molding an IC package | |
| SG65615A1 | Bga moulding assembly for encapsulating bga substrates of varying thickness | |
| SG47373A1 | Sequential pellet loading station | |
| SG50380A1 | Pick and place system | |
| US5533336A | Hydroelectric cylinder for improved power amplification and control | |
| GB9225356D0 | Direct drive electro-mechanical press for encapsulating semiconductor devices | |
| SG46299A1 | Direct drive electro-mechanical press for encapsulating semiconductor devices | |
| KR100239041B1 | Encapsulation of lead frames | |
| GB9209664D0 | Encapsulation of lead frames |