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LAMBDA TECHNOLOGIES INC

Overview
  • Total Patents
    42
  • GoodIP Patent Rank
    223,676
About

LAMBDA TECHNOLOGIES INC has a total of 42 patent applications. Its first patent ever was published in 1995. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets machines, electrical machinery and energy and semiconductors are APIC YAMADA CORP, BESI NETHERLANDS BV and TOWA CORP.

Patent filings per year

Chart showing LAMBDA TECHNOLOGIES INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Fathi Zakaryae 32
#2 Wei Jianghua 28
#3 Garard Richard S 26
#4 Tucker Denise A 13
#5 Ahmad Iftikhar 7
#6 Reisner Howard M 5
#7 Kingdon Henry Shannon 4
#8 Lundblad Roger Lauren 4
#9 Geisler William L 3
#10 Hampton Michael L 3

Latest patents

Publication Filing date Title
US2011076787A1 Method and apparatus for uniform microwave treatment of semiconductor wafers
US2007284034A1 Resonating conductive traces and methods of using same for bonding components
AU2003241305A1 Methods and apparatus of joining optically coupled optoelectronic and fiber optic components using electromagnetic radiation
US6872927B2 Systems and methods for processing pathogen-contaminated mail pieces
US6268200B1 Biotherapeutic virus attenuation using variable frequency microwave energy
US6103812A Microwave curable adhesive
CA2250817A1 Curing liquid resin encapsulants of microelectronics components with microwave energy
AU2662097A Curing liquid resin encapsulants of microelectronics components with microwave energy
AU2539597A Conductive insert for bonding components with microwave energy
US5738915A Curing polymer layers on semiconductor substrates using variable frequency microwave energy
AU6972996A Systems and methods for monitoring material properties using microwave energy
US5798395A Adhesive bonding using variable frequency microwave energy
US5750968A System and apparatus for reducing arcing and localized heating during microwave processing
US5644837A Process for assembling electronics using microwave irradiation