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BESI NETHERLANDS BV

Overview
  • Total Patents
    153
  • GoodIP Patent Rank
    16,011
  • Filing trend
    ⇧ 750.0%
About

BESI NETHERLANDS BV has a total of 153 patent applications. It increased the IP activity by 750.0%. Its first patent ever was published in 2004. It filed its patents most often in Taiwan, Singapore and Malaysia. Its main competitors in its focus markets machines, semiconductors and audio-visual technology are TOWA CORP, ADWELDS KK and APIC YAMADA CORP.

Patent filings per year

Chart showing BESI NETHERLANDS BVs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Venrooij Johannes Lambertus Gerardus Maria 33
#2 Gal Wilhelmus Gerardus Jozef 31
#3 Van Driel Albertus Franciscus Gerardus 19
#4 Huisstede Jurgen Hendrikus Gerhardus 19
#5 Fierkens Henricus Antonius Maria 18
#6 Hermans Mark 14
#7 Zweers Johannes Gerhardus Augustinus 11
#8 Teunissen Michel Hendrikus Lambertus 8
#9 Zijl Joannes Leonardus Jurrian 8
#10 Wilhelmus Gerardus Jozef Gal 6

Latest patents

Publication Filing date Title
NL2021845B1 Mould half and mould method for encapsulating electronic components mounted on a carrier including a dual support surface and a method for using such
NL2021552B1 Method and device for selective separating electronic components from a frame with electronic components
NL2021145B1 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
NL2021058B1 Method, foil, mould part and surface layer for encapsulating electronic components mounted on a carrier using expansion spaces absorbing local foil layer displacements
NL2020360B1 Handler device for handling substrates
NL2019767B1 Press part for supporting a mould part for encapsulating electronic components mounted on a carrier and a press comprising the press part
NL2018533B1 Plunger for feeding encapsulating material to a mould cavity
NL2016011B1 Press, actuator set and method for encapsulating electronic components with at least two individual controllable actuators.
NL2015895B1 Device and method for thermal compression bonding electronic components on a carrier.
NL2015091B1 Mould, moulding press and method for encapsulating electronic components mounted on a carrier using elastomeric micro-pillars.
NL2014802A Modular system for moulding electronic components and kit-of-parts for assembling such a modular system.
NL2013978B1 Device and method for controlled moulding and degating of a carrier with electronic components and moulded product.
NL2011575C2 Method for positioning a carrier with electronic components and electronic component produced with such method.
NL2011512C2 Method for moulding and surface processing electronic components and electronic component produced with this method.
NL2010379C2 TEMPLATE, CARRIER WITH ELECTRONIC COMPONENTS TO BE COVERED, CARRIER WITH ELECTRONIC COMPONENTS COVERED, SAVED COVERED ELECTRONIC COMPONENT AND METHOD OF COVERING ELECTRONIC COMPONENTS.
MY159395A Device and method for conditioning and monitoring of a saw blade