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FICO BV

Overview
  • Total Patents
    417
About

FICO BV has a total of 417 patent applications. Its first patent ever was published in 1989. It filed its patents most often in Netherlands, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets machines, semiconductors and audio-visual technology are LAMBDA TECHNOLOGIES INC, MEIO KASEI KK and APIC YAMADA CORP.

Patent filings per year

Chart showing FICO BVs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Harmsen Wilhelmus Hendrikus Jo 58
#2 Venrooij Johannes Lambertus Ge 53
#3 Gal Wilhelmus Gerardus Jozef 42
#4 Zijl Joannes Leonardus Jurrian 41
#5 Van Egmond Henri Joseph 31
#6 Hennekes Willem Antonie 29
#7 Peters Hendrikus Johannes Bern 25
#8 Van Dalen Adrianus Wilhelmus 24
#9 Dannenberg Johannes Lambertus 17
#10 Wensink Hendrik 13

Latest patents

Publication Filing date Title
NL2009147C2 Device and method for separating, at least partial drying and inspection of electronic components.
NL2008290C2 Method and device for placing electronic components suited in a matrix structure.
NL2007614C2 Method and device for covering electronic components using a reduction material undertaking a phase transition
NL2007110C2 Device for cleaning an enclosure device for electronic components.
NL2007074C2 Method for stacked connection of electronic components, support with electronic component for stacked connection, and support assembly.
NL2005941C2 Sealing of a saw machine for separating electronic components and sawing machine fitted with such sealing.
NL2005626C2 Carrier for separated electronic components and method for visual inspection of separated electronic components.
NL2003792C2 Method and device for coating electronic components with controlled gas pressure
NL2002240C2 Device and method for at least partly covering of a closed flat carrier with electronic components.
NL2002073C Device and method for positioning electronic components in a treatment tool.
NL2001818C2 Method for encapsulating electronic components with a controllable closing force.
NL2001790C2 Device and method for cutting electronic components.
NL2001642C2 Device and method for drying separated electronic components.
NL2000930C2 Method and device for encapsulating electronic components with liquid portioned encapsulating material.
NL2000488C2 Method and device for enveloping electronic components with the aid of underpressure.
NL2000449C2 Method and device for mechanically processing semiconductor products in a press.
NL2000356C2 Method and device for encapsulating electronic components wherein the encapsulating material is cooled.
KR20080047614A Device and method for separating electronic components
TW200714379A Method and device for cleaning electronic components processed with a laser beam
CN101927550A Press machine with plate frame and operating method thereof