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ADVANCED SYSTEMS AUTOMATION

Overview
  • Total Patents
    73
About

ADVANCED SYSTEMS AUTOMATION has a total of 73 patent applications. Its first patent ever was published in 1993. It filed its patents most often in Singapore, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, machines and machine tools are BESI NETHERLANDS BV, TOWA CORP and ADVANCED SYSTEMS AUTOMATION LTD.

Patent filings per year

Chart showing ADVANCED SYSTEMS AUTOMATIONs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chew Hwee Seng Jimmy 14
#2 Chen Qiong 12
#3 Liu Fulin 10
#4 Lim Kok Yeow 6
#5 Xia Dingwei 6
#6 Lau Tay Hock 6
#7 Lim Kok Yeow Eddy 5
#8 Jimmy Chew Hwee Seng 4
#9 He Zhen Hua 4
#10 Wang Zi Yao 4

Latest patents

Publication Filing date Title
SG146495A1 Flow front and mold bleed control system and method
SG144777A1 Direct molding system and process
CN101084572A Singulating and de-tapping arrays of semiconductor packages
WO2006041411A1 Cooling and lubrication system
WO2005103656A1 Multiple surface viewer
SG145540A1 Semiconductor package singulating system and method
MY157105A Handler for semiconductor singulation and method therefor
CN1613146A Flip chip bonder and method therefor
SG111091A1 Handler for semiconductor singulation and method therefor
SG105541A1 Method and apparatus for singulating semiconductor packages on a lead frame
SG112822A1 Method and apparatus for selective removal of material
SG102646A1 Apparatus and method for direct transfer of an electrolytically formed antenna
SG107567A1 Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package
SG120053A1 Apparatus for molding a semiconductor wafer and process therefor
SG103835A1 Transfer molding machine with features for enhanced cull removal
SG96579A1 Method and apparatus for a laser system for severing semiconductor wafers
TW439107B Apparatus for singulating a molded panel with a plurality of IC devices and method for cutting a panel of IC devices connected by a multilayer substrate
SG84519A1 Method and apparatus for removal of mold flash
SG75883A1 Redistribution system
SG81246A1 Flex tape assembly for use in bga packaging