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APIC YAMADA CORP

Overview
  • Total Patents
    768
  • GoodIP Patent Rank
    7,789
  • Filing trend
    ⇩ 3.0%
About

APIC YAMADA CORP has a total of 768 patent applications. It decreased the IP activity by 3.0%. Its first patent ever was published in 1993. It filed its patents most often in Japan, Republic of Korea and Taiwan. Its main competitors in its focus markets machines, semiconductors and audio-visual technology are TOWA CORP, BESI NETHERLANDS BV and ADWELDS KK.

Patent filings per year

Chart showing APIC YAMADA CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Miyajima Fumio 118
#2 Kobayashi Kazuhiko 88
#3 Nakazawa Hideaki 77
#4 Fujisawa Masahiko 57
#5 Saito Takashi 54
#6 Kawaguchi Makoto 46
#7 Uchiyama Shigeyuki 44
#8 Muramatsu Yoshikazu 41
#9 Tagami Shusaku 41
#10 Nakajima Kenji 36

Latest patents

Publication Filing date Title
JP2021000838A Molding die and resin molding device
KR20210011326A Work carry-in device, work take-out device, molding die and resin molding apparatus having the same
JP2020108973A Resin molding apparatus and resin molding method
JP2020162289A Manufacturing method of motor core plate, manufacturing method of motor core, metal mold, and motor core plate manufacturing apparatus
JP2019111820A Resin mold apparatus
JP2020107700A Resin supply and extraction device, work transfer device, and resin molding device
TW201936357A Mold base, mold casing unit, compression-molding mold, and compression-molding device capable of performing compression molding with high precision
TW201934295A Resin molding mold and resin molding method efficiently supplies the film and the molded resin and shorten the manufacturing time
JP2020082529A Resin mold press apparatus and resin mold apparatus
JP2019010886A Resin molding method and resin molding apparatus
JP2019010887A Resin molding method and resin molding apparatus
JP2020029045A Mold and resin molding apparatus provided with the same
JP2020026088A Workpiece carrying device, resin carrying device, and resin molding device
JP2019202240A Metal component manufacturing method and metal component manufacturing apparatus
JP2019200504A Chip unit, booster antenna, rfid tag, mold, mold device, and manufacturing supporting system
JP2019181872A Mold tool, resin molding device and resin molding method
JP2019186462A Mold, resin molding apparatus, resin molding method, and conveying tool
JP2019166720A Resin molding apparatus
JP2019145548A Resin mold device and resin mold method
JP2019145550A Resin mold device and resin mold method