| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Malaysia | 7 | |
| #2 | Singapore | 7 | |
| #3 | Republic of Korea | 1 | |
| #4 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Measurement | |
| #4 | Chemical engineering | |
| #5 | Thermal processes | |
| #6 | Audio-visual technology | |
| #7 | Packaging and shipping | |
| #8 | Machine tools |
| # | Name | Total Patents |
|---|---|---|
| #1 | Jimmy Chew Hwee Seng | 4 |
| #2 | Xia Dingwei | 4 |
| #3 | Seng Ng Lian | 2 |
| #4 | Hock Lim Kian | 2 |
| #5 | Qiong Chen | 2 |
| #6 | Huang Yun | 2 |
| #7 | Seng Jimmy Chew Hwee | 2 |
| #8 | Ismail Abdullah | 1 |
| #9 | Yongfeng Lu | 1 |
| #10 | Dawn Lim Lui Ching | 1 |
| Publication | Filing date | Title |
|---|---|---|
| SG154370A1 | Tray flattener | |
| SG154362A1 | Positioning apparatus and method | |
| SG168403A1 | Sawjig clamper | |
| SG182882A1 | Method and apparatus for forming a flip chip semiconductor package and method for producing a substrate for the flip chip semiconductor package | |
| SG178623A1 | Apparatus for molding a semiconductor wafer and process therefor | |
| SG178622A1 | Apparatus for molding a semiconductor wafer and process therefor | |
| SG77182A1 | Temperature control system for test heads |