| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Micro-structure and nano-technology | |
| #3 | Optics | |
| #4 | Environmental technology |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yen Yu-Lin | 11 |
| #2 | Liu Tsang-Yu | 8 |
| #3 | Chen Chien-Hui | 5 |
| #4 | Yeou Long-Sheng | 5 |
| #5 | Fan Chen-Mei | 2 |
| #6 | Huang Yu-Lung | 2 |
| #7 | Ho Yen-Shih | 2 |
| #8 | Chen Shih-Ming | 1 |
| #9 | Liu Kuo-Hua | 1 |
| #10 | Lin Hsi-Chien | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2012112329A1 | Chip package | |
| US2011278734A1 | Chip package | |
| US2011278735A1 | Chip package | |
| US2011193241A1 | Chip package and method for forming the same | |
| US2007218410A1 | Method for forming a material layer |