|
US6294935B1
|
|
Built-in-self-test circuitry for testing a phase locked loop circuit
|
|
US6372522B1
|
|
Use of optimized film stacks for increasing absorption for laser repair of fuse links
|
|
US6326283B1
|
|
Trench-diffusion corner rounding in a shallow-trench (STI) process
|
|
US6207565B1
|
|
Integrated process for ashing resist and treating silicon after masked spacer etch
|
|
US6374398B1
|
|
Efficient database for die-per-wafer computations
|
|
US6150234A
|
|
Trench-diffusion corner rounding in a shallow-trench (STI) process
|
|
US6211045B1
|
|
Incorporation of nitrogen-based gas in polysilicon gate re-oxidation to improve hot carrier performance
|
|
US6472253B1
|
|
Programmable semiconductor device structures and methods for making the same
|
|
US6380001B1
|
|
Flexible pin count package for semiconductor device
|
|
US6353368B1
|
|
VCO circuit using negative feedback to reduce phase noise
|
|
US6314154B1
|
|
Non-power-of-two Gray-code counter and binary incrementer therefor
|
|
US6341998B1
|
|
Integrated circuit (IC) plating deposition system and method
|
|
US6084464A
|
|
On-chip decoupling capacitor system with parallel fuse
|
|
US6258611B1
|
|
Method for determining translation portion of misalignment error in a stepper
|
|
US6159075A
|
|
Method and system for in-situ optimization for semiconductor wafers in a chemical mechanical polishing process
|
|
US6346032B1
|
|
Fluid dispensing fixed abrasive polishing pad
|
|
US6378044B1
|
|
Method and system for cache replacement among configurable cache sets
|
|
US6363466B1
|
|
Interface and process for handling out-of-order data transactions and synchronizing events in a split-bus system
|
|
US6316834B1
|
|
Tungsten plugs for integrated circuits and method for making same
|
|
US6196900B1
|
|
Ultrasonic transducer slurry dispenser
|
