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TOSHIBA COMPONENTS

Overview
  • Total Patents
    124
About

TOSHIBA COMPONENTS has a total of 124 patent applications. Its first patent ever was published in 1978. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, measurement and audio-visual technology are Suzhou hanhua semiconductor co ltd, ALPAD CORP and TREZZA JOHN.

Patent filings in countries

World map showing TOSHIBA COMPONENTSs patent filings in countries
# Country Total Patents
#1 Japan 124

Patent filings per year

Chart showing TOSHIBA COMPONENTSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shigesawa Shinji 11
#2 Inoue Yoshiaki 7
#3 Matsumoto Shinichi 6
#4 Abe Yuji 6
#5 Sasaki Satoshi 5
#6 Shiraishi Kazuaki 5
#7 Yonekura Hiromi 5
#8 Sekiba Toshinobu 5
#9 Kera Fumio 5
#10 Nagano Akira 5

Latest patents

Publication Filing date Title
JP2010003917A Sip type resin-sealed semiconductor device
JP2009295748A Resin sealed semiconductor device and production process of same
JP2009111248A Connector joined type compound semiconductor device
JP2009059961A Die bonder device
JP2009038145A Lead terminal type semiconductor device
JP2008112858A Resin sealed semiconductor device
JP2008109056A Resin sealed type semiconductor element and manufacturing method thereof
JP2007234633A Glass epoxy substrate
JP2007121190A Electrical tester of lead insert type semiconductor device
JP2007105663A Liquid application apparatus
JP2007098348A Multi-nozzle for liquid coater and liquid coater
JP2007103726A Soldering apparatus for lead frame
JP2007088264A Resin sealed semiconductor device
JP2007088263A Terminal-frame structure
JP2006344652A Semiconductor device and method of mounting semiconductor component
JP2006318974A Semiconductor device using bump structure and its manufacturing method
JP2006119464A Single core bidirectional optical transceiver
JP2006098763A Optical receiving module and optical transmitting module
JP2006041116A Compound transistor module
JP2005084521A Optical communication module