US2014071642A1
|
|
Low stress component package
|
US2013260510A1
|
|
3-D Integrated Circuits and Methods of Forming Thereof
|
US2013234330A1
|
|
Semiconductor Packages and Methods of Formation Thereof
|
US2013175527A1
|
|
Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangement
|
US2012073371A1
|
|
Microelectromechanical accelerometer with wireless transmission capabilities
|
US2012073372A1
|
|
Microelectromechanical system
|
US2013043575A1
|
|
Chip-packaging module for a chip and a method for forming a chip-packaging module
|
US2011163440A1
|
|
Semiconductor device
|
US2010276769A1
|
|
Semiconductor device including a magnetic sensor chip
|
US2010203676A1
|
|
Chip assembly
|
US2009313817A1
|
|
Sensor module
|
US2009309191A1
|
|
Semiconductor device
|
US2009295381A1
|
|
Magnetic sensor integrated circuit device and method
|
US2009256361A1
|
|
Energy harvester
|
US2009243595A1
|
|
Sensor module with mold encapsulation for applying a bias magnetic field
|
US2009153138A1
|
|
Sensor module and method for manufacturing a sensor module
|
US2008298621A1
|
|
Module including a micro-electro-mechanical microphone
|
US2008164598A1
|
|
Semiconductor module
|
US2008135959A1
|
|
Semiconductor component comprising magnetic field sensor
|