| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | China | 2 | |
| #3 | EPO (European Patent Office) | 1 | |
| #4 | Republic of Korea | 1 | |
| #5 | Malaysia | 1 | |
| #6 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Measurement |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Measuring electric variables |
| # | Name | Total Patents |
|---|---|---|
| #1 | Heng Yh | 3 |
| #2 | Yong Tan Kek | 3 |
| #3 | Seng Lee Boon | 3 |
| #4 | Ng Cheeyang | 3 |
| #5 | Lee Boon Seng | 2 |
| #6 | Tan Kek Yong | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US9679832B1 | Rough leadframe with a nanolayer of silver | |
| US2016172273A1 | Integrated circuit device with plating on lead interconnection point and method of forming the device | |
| US2015001697A1 | Selective treatment of leadframe with anti-wetting agent | |
| MY131859A | Test handler apparatus for smd ( surface mount devices), bga ( ball grid arrays) and csp ( chip scale packages) |