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TELEPHUS INC

Overview
  • Total Patents
    50
About

TELEPHUS INC has a total of 50 patent applications. Its first patent ever was published in 1999. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and Australia. Its main competitors in its focus markets semiconductors, audio-visual technology and basic materials chemistry are PHOENIX PIONEER TECHNOLOGY CO LTD, ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECH CO LTD and SUMISE DEVICE KK.

Patent filings per year

Chart showing TELEPHUS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kwon Young-Se 12
#2 Nam Choong-Mo 10
#3 Nam Chung Mo 7
#4 Kim Dong Uk 7
#5 Jeong In-Ho 5
#6 Lee Jong Su 5
#7 Hwang Jin Sang 5
#8 Jung In Ho 5
#9 Lim Myeong Jin 4
#10 Kim Dong-Wook 3

Latest patents

Publication Filing date Title
KR20070109097A Electrode structure having projections on electrode pad, device mounting structure having the same and method of mounting device
KR20060124834A Integrated passive device chip and process of the same
US2006033213A1 Multilayered anisotropic conductive adhesive for fine pitch
US2006035036A1 Anisotropic conductive adhesive for fine pitch and COG packaged LCD module
KR20050082018A Flip chip bonding method using screen printing method
US6934430B2 Optical module used in high frequency band optical communication system
KR20030066297A Optical module used in high frequency band optical communication system
WO2004036650A1 High frequency semiconductor device and producing the same
KR20030011706A High frequency semiconductor device and producing the same
TWI297722B Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages
WO03000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same
KR20030091238A Multilayered anisotropic conductive adhesive for fine pitch
KR20030086812A Anisotropic conductive adhesives for fine pitch and COG packaged LCD modules
KR20030083503A High frequency semiconductor device
KR20030082063A Method of flip chip bonding using non-conductive adhesive
KR20030080159A An unit anodizing reactor and multi anodizing apparatus having the same
KR20030001231A Anisotropic conductive adhesives having enhanced viscosity, bonding methods using the same and integrated cirduit pakages
KR20030075711A Surface acoustic wave filter package
KR20030074938A High frequency semiconductor device and method of fabricating the same
KR20030073821A Switch module