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ZHEJIANG JIMAIKE MICRO ELECTRONICS CO LTD

Overview
  • Total Patents
    68
  • GoodIP Patent Rank
    21,518
About

ZHEJIANG JIMAIKE MICRO ELECTRONICS CO LTD has a total of 68 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and micro-structure and nano-technology are WEIDNER KARL, WAVENICS INC and PHOENIX PIONEER TECHNOLOGY CO LTD.

Patent filings in countries

World map showing ZHEJIANG JIMAIKE MICRO ELECTRONICS CO LTDs patent filings in countries
# Country Total Patents
#1 China 68

Patent filings per year

Chart showing ZHEJIANG JIMAIKE MICRO ELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Feng Guangjian 62
#2 Ma Fei 30
#3 Gao Qun 22
#4 Huang Lei 21
#5 Guo Xi 20
#6 Cheng Mingfang 20
#7 Yu Faxin 17
#8 Gu Maomao 16
#9 Wang Yonghe 14
#10 Cai Yongqing 5

Latest patents

Publication Filing date Title
CN112203400A PCB structure with liquid heat dissipation function
CN112203398A Liquid cooling heat dissipation process for PCB
CN112203401A PCB structure with liquid heat dissipation function
CN112203399A PCB assembly process with liquid heat dissipation function
CN112062085A Manufacturing process of silicon-based photoresist medium transverse transmission line structure
CN112133682A Chip assembly, heat dissipation circuit device and mobile terminal
CN111769088A Stacking packaging structure based on back liquid cooling import and preparation method thereof
CN111952196A Groove chip embedding process
CN111970906A Phased array radar heat abstractor
CN111952243A Groove chip embedding process
CN111954370A PCB board miniflow channel heat dissipation embedding structure
CN111968919A Heat dissipation process of radio frequency module
CN111952194A Liquid cooling heat dissipation process for radio frequency chip
CN111968941A Wafer-level patch interconnection mode
CN111968942A Interconnecting process for interconnecting radio frequency modules on side walls of adapter plates
CN111968943A Ultra-thin stacking method for radio frequency modules
CN111952244A Flexible circuit board side wall interconnection process
CN111952195A Liquid micro-channel interconnection interface and welding process thereof
CN111968961A Sidewall interconnection plate and manufacturing process thereof
CN111968944A Ultrathin stacking process for radio frequency module