| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 11 | |
| #2 | Republic of Korea | 6 | |
| #3 | China | 3 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Huang Alex | 19 |
| #2 | Hurwitz Dror | 13 |
| #3 | Dror Hurwitz | 7 |
| #4 | Alex Huang | 1 |
| Publication | Filing date | Title |
|---|---|---|
| KR20170026214A | Improved chip package | |
| US2017213793A1 | Embedded packages | |
| US2017117161A1 | Terminations | |
| US2017005058A1 | Chip package | |
| US2017005057A1 | Chip package | |
| US2016165731A1 | Method of fabricating a polymer frame with a rectangular array of cavities | |
| US2015228416A1 | Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor | |
| US2015214171A1 | Composite electronic structure with partially exposed and protruding copper termination posts | |
| US2015042415A1 | Multilayer electronic structures with embedded filters |