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LIN CHARLES W C

Overview
  • Total Patents
    50
About

LIN CHARLES W C has a total of 50 patent applications. Its first patent ever was published in 2009. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are UNIMICRON CO LTD, SUMISE DEVICE KK and NIPPON MICRON KK.

Patent filings in countries

World map showing LIN CHARLES W Cs patent filings in countries
# Country Total Patents
#1 United States 50

Patent filings per year

Chart showing LIN CHARLES W Cs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lin Charles W C 50
#2 Wang Chia-Chung 48
#3 Lim Sangwhoo 10
#4 Shih Ming Yu 2
#5 Sigmond David M 2
#6 Wang Chia Chung 2

Latest patents

Publication Filing date Title
US2014048324A1 Hybrid wiring board with built-in stopper, interposer and build-up circuitry
US2013032388A1 Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
US2013032938A1 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
US2012129299A1 Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
US2012129298A1 Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
US2012126399A1 Thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
US2011278638A1 Semiconductor chip assembly with post/dielectric/post heat spreader
US2011227122A1 Semiconductor chip assembly with post/base heat spreader with thermal via
US2011198662A1 Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
US2011175136A1 Semiconductor chip assembly with post/base heat spreader and plated through-hole
US2011156090A1 Semiconductor chip assembly with post/base/post heat spreader and asymmetric posts
US2011101410A1 Semiconductor chip assembly with post/base/post heat spreader
US2011104855A1 Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
US2011089465A1 Semiconductor chip assembly with post/base heat spreader with ESD protection layer
US2011079811A1 Semiconductor chip assembly with bump/base heat spreader and dual-angle cavity in bump
US2011037094A1 Semiconductor chip assembly with bump/base heat spreader and cavity in bump
US2010327310A1 Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange
US8324653B1 Semiconductor chip assembly with ceramic/metal substrate
US8232576B1 Semiconductor chip assembly with post/base heat spreader and ceramic block in post
US2010289054A1 Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal