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WAVENICS INC

Overview
  • Total Patents
    43
  • GoodIP Patent Rank
    234,699
About

WAVENICS INC has a total of 43 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and machines are DAWNING LEADING TECHNOLOGY INC, PHOENIX PIONEER TECHNOLOGY CO LTD and SUMISE DEVICE KK.

Patent filings per year

Chart showing WAVENICS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kwon Young-Se 20
#2 Kim Kyoung Min 18
#3 Kim Kyoung-Min 12
#4 Kwon Young Se 8
#5 Kim Jae-Ho 4
#6 Shin Seung Chul 3
#7 Yu Je-In 3
#8 Kim Jung Hyun 3
#9 Cho Chang Hee 2
#10 Hyun Sung-Woo 2

Latest patents

Publication Filing date Title
KR20160030656A Light emitting device package, light emitting device package module, lighting device and its manufacturing method
KR101275141B1 Light emitting device
US2011033962A1 High efficiency led with multi-layer reflector structure and method for fabricating the same
WO2011136417A1 Integrated-terminal-type metal base package module and a method for packaging an integrated terminal for a metal base package module
WO2011136403A1 Method for manufacturing a metal-based package having a via structure
WO2011136404A1 Photonic device package module and manufacturing method thereof
KR20110080015A Structure of package module for high power device with matal base and process of the same
KR20110080014A High quality passive element module having air-cavity and process of the same
KR20100069544A Process of metal-based package with via
KR20100069545A Terminal integrated type metal-based package module and terminal integrated type packaging method for metal-based package module
KR20100114302A Photonic device package module and process of the same
KR20100092612A Heat sink integrated photonic device package module and process of the same
KR20090071427A Manufacturing Process of Passive Element with Dielectric Core
KR20090079155A Photonic device package platform using metal board and process of the same
WO2008153245A2 Semiconductor package module using anodized oxide layer and manufacturing method thereof
KR20080108885A Semiconductor package module using anodized oxide layer and manufacturing method thereof
KR100860533B1 Method of fabricating metal pcb
KR20090012664A Metal base package substrate and three dimensional multilayer package module using metal base package substrate, and fabrication method thereof
KR20090003037A Metal-based photonic device package module and process of the same
KR20060088532A Fabrication method of high quality inductor in package using a selectively anodized metal