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NIPPON MICRON KK

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    232,912
About

NIPPON MICRON KK has a total of 38 patent applications. Its first patent ever was published in 1987. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and environmental technology are LIN CHARLES W C, UNIMICRON CO LTD and SUMISE DEVICE KK.

Patent filings in countries

World map showing NIPPON MICRON KKs patent filings in countries
# Country Total Patents
#1 Japan 38

Patent filings per year

Chart showing NIPPON MICRON KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Komatsu Takatsugu 38
#2 Tanaka Tadashige 2
#3 Kinoshita Takatomi 1
#4 Komi Toshiharu 1
#5 Shimojima Yasuo 1
#6 Baba Yuichi 1
#7 Ueno Yutaka 1
#8 Kiuchi Sukeyuki 1

Latest patents

Publication Filing date Title
JP2017188636A Component built-in electronic circuit board
JP2008166634A Package for electronic component
JP2007116071A Package for electronic part
JP2007005741A Package for electronic component
JP2005116992A Package for electronic component
JP2005011837A Semiconductor device, substrate therefor, and its manufacturing method
JP2004319848A Semiconductor device and its manufacturing process
JP2004319807A Semiconductor device and its manufacturing process
JP2003179180A Device and method for carving inner layer circuit for electronic component package
JP2003179361A Printed-wiring board and method of manufacturing the same
JP2003115559A Printed wiring board and manufacturing method thereof
JP2001332657A Semiconductor package
JP2001308219A Package for electronic component
JP2001291800A Package for electronic component
JP2001041765A Destination guide system
JP2000064066A Shower injection device for electronic device and shower injection
JPH10321761A Semiconductor package
JPH10284642A Highly heat dissipating ic package substrate
JPH10284639A Semiconductor package, manufacturing method therefor, semiconductor package transport tool and manufacturing method therefor
JPH1041436A Manufacture of semiconductor package