TEH WENG HONG has a total of 12 patent applications. Its first patent ever was published in 2011. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and electrical machinery and energy are KOJIMA AKIHIRO, INFINEON TECH DRESDEN GMBH & CO KG and INFINEON TECHNOLOGIES DRESDEN GMBH.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology | |
#3 | Electrical machinery and energy | |
#4 | Audio-visual technology | |
#5 | Measurement | |
#6 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Teh Weng Hong | 12 |
#2 | Ma Qing | 2 |
#3 | Haney Sarah K | 2 |
#4 | Zhong Shan | 2 |
#5 | Guzek John S | 2 |
#6 | Sobieski Daniel N | 2 |
#7 | Eid Feras | 1 |
#8 | Kamgaing Telesphor | 1 |
#9 | Lim Chyi Hwang | 1 |
#10 | Sankman Robert Bob L | 1 |
Publication | Filing date | Title |
---|---|---|
US2015002984A1 | Method of forming a magnetic mems tunable capacitor | |
US2014264830A1 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | |
US2014001583A1 | Method to inhibit metal-to-metal stiction issues in mems fabrication | |
US2014002178A1 | Semiconductor package with mechanical fuse | |
US2014203379A1 | Integration of laminate MEMS in BBUL coreless package | |
US2012326271A1 | Secondary device integration into coreless microelectronic device packages |