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TEGAL CORP

Overview
  • Total Patents
    230
About

TEGAL CORP has a total of 230 patent applications. Its first patent ever was published in 1973. It filed its patents most often in United States, EPO (European Patent Office) and Japan. Its main competitors in its focus markets semiconductors, electrical machinery and energy and surface technology and coating are SPP TECHNOLOGIES CO LTD, TEL EPION INC and HONDA MASANOBU.

Patent filings per year

Chart showing TEGAL CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Deornellas Stephen P 56
#2 Nguyen Tue 35
#3 Jerde Leslie G 35
#4 Cofer Alferd 34
#5 Nguyen Tai Dung 20
#6 Olson Kurt A 16
#7 Vail Robert C 13
#8 Rajora Paritosh 12
#9 Bercaw Craig Alan 12
#10 Ditizio Robert A 10

Latest patents

Publication Filing date Title
US2009246385A1 Control of crystal orientation and stress in sputter deposited thin films
US2008083611A1 High-adhesive backside metallization
EP2032744A2 System and method for semiconductor processing
WO2007109117A2 Dry etch stop process for eliminating electrical shorting in mram device structures
CN101449361A Dry etch stop process for eliminating electrical shorting in mram device structures
US2007155027A1 Dry etch stop process for eliminating electrical shorting in MRAM device structures
US2007026626A1 Integrated decoupling capacitor process
US2007020898A1 System and method for semiconductor processing
US2007020945A1 Semiconductor processing system and method
EP1677338A1 Apparatus and method for controlling etch depth during plasma alternating etching of semiconductor substrates
US2006040055A1 Method and system for sequential processing in a two-compartment chamber
US2006046412A1 Method and system for sequential processing in a two-compartment chamber
US2006051881A1 System and method for processing a wafer including stop-on-aluminum processing
US7179350B2 Reactive sputtering of silicon nitride films by RF supported DC magnetron
US7163721B2 Method to plasma deposit on organic polymer dielectric film
US7713592B2 Nanolayer deposition process
US6919101B2 Method to deposit an impermeable film on porous low-k dielectric film
US6921555B2 Method and system for sequential processing in a two-compartment chamber
US7153542B2 Assembly line processing method
US6858085B1 Two-compartment chamber for sequential processing