| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 4 | |
| #2 | China | 2 | |
| #3 | EPO (European Patent Office) | 2 | |
| #4 | United States | 2 | |
| #5 | Republic of Korea | 1 | |
| #6 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Computer technology | |
| #4 | Thermal processes |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Electric discharge tubes | |
| #3 | Electric digital data processing | |
| #4 | Heat-exchange device details |
| # | Name | Total Patents |
|---|---|---|
| #1 | Huang Fu-Kuo | 5 |
| #2 | Ko Fukukoku | 4 |
| #3 | Huang Fuguo | 1 |
| #4 | Guozhang Su | 1 |
| #5 | Huang Fu Kuo | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN101140380A | Back light module unit structure | |
| US2007115641A1 | Heat sink apparatus | |
| JP2007180109A | Led with expanded irradiation area | |
| CN1971891A | Heat radiator | |
| JP2007115824A | Heat radiation device | |
| TW200642841A | After glow lighting film having UV filtering and explosion-proof |