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TATSUTA SYSTEM ELECTRONICS KK

Overview
  • Total Patents
    35
About

TATSUTA SYSTEM ELECTRONICS KK has a total of 35 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Japan and China. Its main competitors in its focus markets audio-visual technology, semiconductors and basic materials chemistry are AMITEC ADVANCED MULTILAYER INT, SUNOHARA MASAHIRO and IBIS INNOTECH INC.

Patent filings in countries

World map showing TATSUTA SYSTEM ELECTRONICS KKs patent filings in countries
# Country Total Patents
#1 Japan 33
#2 China 2

Patent filings per year

Chart showing TATSUTA SYSTEM ELECTRONICS KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Morimoto Shohei 11
#2 Terada Tsunehiko 10
#3 Hashimoto Kazuhiro 9
#4 Kawakami Tokinori 8
#5 Umeda Hiroaki 7
#6 Ueno Kenji 7
#7 Noboritouge Masayuki 5
#8 Iwai Yasushi 5
#9 Miyamoto Masanori 5
#10 Murakami Hisatoshi 3

Latest patents

Publication Filing date Title
JP2010199528A Bonding wire
JP2010168510A Adhesive composition
JP2010168518A Conductive self-adhesive sheet, electromagnetic wave shielding material including the same, and printed wiring board
JP2009290103A Electromagnetic shield member and printed circuit board
JP2009191099A Conductive adhesive sheet and circuit board having the same, method for producing conductive adhesive sheet
JP2009038278A Shielding film for printed wiring board and printed wiring board
JP2009016715A High-frequency module having shielding and heat radiating performance and manufacturing method for high-frequency module
JP2007294996A Shielding film, shielding printed wiring board, shielding flexible printed circuit board, and method of manufacturing shielding film and shielding printed wiring board
JP2008263036A Rigid wiring board with shield layer and its manufacturing method
JP2008239834A Protective film
JP2007294918A Shielding film and shielding printed wiring board
JP2008227295A Manufacturing method of light emitting diode substrate
JP2008187053A Thermally-conductive and electrically-conductive paste, substrate for light-emitting diode using the same, and method of manufacturing substrate
JP2008147220A Method of manufacturing multilayer wiring board and multilayer wiring board obtained thereby
JP2008108625A Conductive adhesive
JP2008108629A Conductive paste and multilayer board using this
JP2008069238A Thermoconductive paste
JP2007328485A Personal identification device
JP2007301060A Individual authentication device
JP2007189091A Isotropic conductive bonding sheet and circuit substrate