IBIS INNOTECH INC has a total of 29 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2009. It filed its patents most often in United States, Taiwan and China. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are MIYOSHI ELECTRONICS CORP, AMITEC ADVANCED MULTILAYER INT and SUNOHARA MASAHIRO.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 12 | |
#2 | Taiwan | 9 | |
#3 | China | 8 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Electrical machinery and energy | |
#4 | Computer technology | |
#5 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Liu Wen-Chun | 20 |
#2 | Lai Wei-Jen | 19 |
#3 | Huang Chih-Kung | 7 |
#4 | Liu Wen Chun | 3 |
#5 | Lai Wei Jen | 2 |
#6 | Huang Chih Kung | 2 |
#7 | Liu Wenjun | 1 |
#8 | Lai Weiren | 1 |
#9 | Xie Zheng-Yang | 1 |
#10 | Hsieh Cheng-Yang | 1 |
Publication | Filing date | Title |
---|---|---|
US2017256479A1 | Package structure | |
TWI626724B | Package structure | |
TWI623486B | Package structure | |
US2017194241A1 | Package structure and manufacturing method of package structure | |
TW201826893A | Package structure and manufacturing method of package structure | |
CN107527876A | Encapsulating structure | |
US2017077045A1 | Semiconductor structure | |
TW201810587A | Semiconductor structure | |
US2016353575A1 | Package structure | |
TWI606560B | Package structure | |
TWI563608B | Package structure | |
US2016233152A1 | Package structure | |
US2016034083A1 | Touch sensing device | |
TW201601276A | Package substrate strcuture | |
TW201546985A | Package structure | |
US2015060929A1 | Ceramic circuit board and led package module using the same | |
US2010301504A1 | Method of making light-guiding module | |
TW201032993A | Method for manufacturing light guide module |