Learn more

DENKA AGSP KK

Overview
  • Total Patents
    12
About

DENKA AGSP KK has a total of 12 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Japan. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are PHOENIX PREC TECHNOLOGY CORP, NEC TOPPAN CIRCUIT SOLUTIONS T and SUNOHARA MASAHIRO.

Patent filings in countries

World map showing DENKA AGSP KKs patent filings in countries
# Country Total Patents
#1 Japan 12

Patent filings per year

Chart showing DENKA AGSP KKs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors
#2 Audio-visual technology
#3 Machines

Top inventors

# Name Total Patents
#1 Yoshimura Eiji 12
#2 Usami Yoshitaka 2
#3 Suzuki Motohiro 1
#4 Sano Hirokazu 1
#5 Maeda Tetsuo 1

Latest patents

Publication Filing date Title
JP2011009716A Method of manufacturing substrate for light emitting element mounting
JP2011108688A Substrate for mounting light emitting element, and method for producing the same
JP2011040488A Light-emitting element-mounting substrate and light-emitting device
JP2010171270A Substrate for mounting light-emitting element and method of manufacturing the same
JP2010103182A Light-emitting device, and substrate for mounting light-emitting element
JP2010103172A Substrate for mounting light-emitting element, light-emitting element package, and method of manufacturing the substrate
JP2009033199A Light emitting element mounting substrate
JP2010021420A Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element
JP2010021434A Substrate for mounting light-emitting element, light-emitting element panel, light-emitting element package, and method of manufacturing substrate for mounting light-emitting element
JP2009253219A Method of manufacturing wiring board
JP2009253045A Method of manufacturing wiring board
JP2008244285A Light-emitting element mounting substrate and manufacturing method therefor