TAKAHASHI MICHIMASA has a total of 28 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States and China. Its main competitors in its focus markets audio-visual technology, machines and semiconductors are FUKUI PREC COMPONENT SHENZHEN, CDA PROC LTD LIABILITY COMPANY and FUKU PREC COMPONENTS SHENZHEN.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 27 | |
#2 | China | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Machines | |
#3 | Semiconductors |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Unspecified technologies | |
#3 | Semiconductor devices |
# | Name | Total Patents |
---|---|---|
#1 | Takahashi Michimasa | 28 |
#2 | Aoyama Masakazu | 14 |
#3 | Mikado Yukinobu | 4 |
#4 | Nakamura Takenobu | 3 |
#5 | Ishihara Teruyuki | 3 |
#6 | Asai Toshinobu | 1 |
#7 | Yanagisawa Hiroyuki | 1 |
#8 | Naganuma Nobuyuki | 1 |
Publication | Filing date | Title |
---|---|---|
US2013153269A1 | Wiring board and method for manufacturing the same | |
US2010132980A1 | Wiring board and fabrication method therefor | |
US2009038836A1 | Wiring board and method of manufacturing wiring board | |
US2008283276A1 | Wiring board and method of manufacturing wiring board | |
US2008283287A1 | Wiring board and method of manufacturing wiring board | |
US2008093118A1 | Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same |