| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Taiwan | 8 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Japan | 1 | |
| #4 | United States | 1 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Mcgregor David Ross | 7 |
| #2 | Borland William J | 3 |
| #3 | Summers John D | 3 |
| #4 | Dietz Karl Hartmann | 3 |
| #5 | Mutoh Tsutomu | 2 |
| #6 | Cox G Sidney | 2 |
| #7 | Borland William | 2 |
| #8 | Dueber Thomas Eugene | 1 |
| #9 | Banerji Sounak | 1 |
| #10 | Palanduz Cengiz Ahmet | 1 |
| Publication | Filing date | Title |
|---|---|---|
| TW201104792A | Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers | |
| US2009023858A1 | Screen-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles |