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FUKU PREC COMPONENTS SHENZHEN

Overview
  • Total Patents
    146
  • GoodIP Patent Rank
    208,244
About

FUKU PREC COMPONENTS SHENZHEN has a total of 146 patent applications. Its first patent ever was published in 2005. It filed its patents most often in China and Japan. Its main competitors in its focus markets audio-visual technology, machines and semiconductors are FUKUI PREC COMPONENT SHENZHEN, NAGANUMA NOBUYUKI and DYNAMIC DETAILS INC.

Patent filings in countries

World map showing FUKU PREC COMPONENTS SHENZHENs patent filings in countries
# Country Total Patents
#1 China 142
#2 Japan 4

Patent filings per year

Chart showing FUKU PREC COMPONENTS SHENZHENs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chengxian Lin 17
#2 He Mingzhan 13
#3 Zuohong Ye 9
#4 Zheng Jianbang 9
#5 Wenqin Li 8
#6 Xu Shibin 8
#7 Hongyi Zhang 8
#8 Zheng Zhaomeng 8
#9 Zhiyi Tu 7
#10 Xingze Liu 7

Latest patents

Publication Filing date Title
CN104254202A Circuit board with embedded electronic component and manufacturing method of circuit board
CN104131278A Blackening reagent and manufacturing method of circuit board
CN104135829A Circuit board and preparation method thereof
CN104113993A Continuous circuit board and method for manufacturing same
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CN103974559A Rigid-flex board and manufacture method thereof
CN103857172A Transparent printing circuit board
CN103857213A Two-sided flexible printed circuit board and manufacturing method thereof
CN103857205A Circuit board laser pore-forming method
CN103857177A Transparent circuit board, and transparent circuit board module and manufacturing method thereof
CN103846967A Blanking die
CN103857176A Circuit board and manufacture method for the same
CN103857211A Transparent circuit board and manufacture method for the same
CN103796431A Line folding mould
CN103796416A Circuit board combining flexible board with hard board and method for manufacturing same
CN103796417A Circuit board and manufacture method thereof
CN103781281A Circuit board and manufacturing method thereof
CN103779289A Connection substrate and package-on-package structure
CN103732008A Piece connection circuit board and manufacturing method thereof