| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 9 | |
| #2 | Taiwan | 1 | |
| #3 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Machines | |
| #3 | Semiconductors | |
| #4 | Macromolecular chemistry and polymers | |
| #5 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Unspecified technologies | |
| #3 | Semiconductor devices | |
| #4 | Compounding ingredients | |
| #5 | Unspecified technologies | |
| #6 | Layered products |
| # | Name | Total Patents |
|---|---|---|
| #1 | Vasoya Kalu K | 11 |
| #2 | Mangrolia Bharat M | 3 |
| #3 | Bohner Richard A | 2 |
| #4 | Davis William E | 2 |
| #5 | Roy Don | 1 |
| Publication | Filing date | Title |
|---|---|---|
| USRE45637E | Processes for manufacturing printed wiring boards | |
| US2011272179A1 | Printed Circuit Board with Embossed Hollow Heatsink Pad | |
| US2006231198A1 | Manufacturing process: how to construct constraining core material into printed wiring board | |
| US2006104035A1 | Edge plated printed wiring boards |