| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 4 | |
| #2 | United States | 4 | |
| #3 | Taiwan | 2 | |
| #4 | EPO (European Patent Office) | 1 | |
| #5 | Republic of Korea | 1 | |
| #6 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Machines | |
| #3 | Semiconductors | |
| #4 | Macromolecular chemistry and polymers | |
| #5 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Casings and printed circuits | |
| #2 | Semiconductor devices | |
| #3 | Unspecified technologies | |
| #4 | Unspecified technologies | |
| #5 | Compounding ingredients | |
| #6 | Layered products |
| # | Name | Total Patents |
|---|---|---|
| #1 | Vasoya Kalu K | 13 |
| #2 | Bohner Richard A | 2 |
| #3 | Mangrolia Bharat M | 2 |
| #4 | Davis William E | 2 |
| Publication | Filing date | Title |
|---|---|---|
| TW201414373A | Build-up printed wiring board substrate having a core layer that is part of a circuit | |
| CN103298243A | Build-up printed wiring board substrate having a core layer that is part of a circuit | |
| KR20080100483A | Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores | |
| US2007215381A1 | Processes for manufacturing printed wiring boards | |
| US2006063428A1 | Printed wiring boards possessing regions with different coefficients of thermal expansion |