| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 8 | |
| #2 | China | 1 | |
| #3 | EPO (European Patent Office) | 1 | |
| #4 | Republic of Korea | 1 | |
| #5 | United States | 1 | |
| #6 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Audio-visual technology | |
| #2 | Machines | |
| #3 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Unspecified technologies | |
| #2 | Casings and printed circuits | |
| #3 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Nitta Haruki | 11 |
| #2 | Takezaki Masanori | 8 |
| #3 | Mizuno Yoshiyuki | 6 |
| #4 | Komaru Masayuki | 5 |
| #5 | Yagi Takafumi | 4 |
| #6 | Nagai Hajime | 3 |
| #7 | Sumi Hideo | 3 |
| #8 | Yagi Masashi | 2 |
| #9 | Masayuki Komaru | 1 |
| #10 | Kihata Makoto | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2009170654A | Printed circuit board and method of manufacturing printed circuit board | |
| JP2008198747A | Printed circuit board and manufacturing method thereof | |
| JP2008198660A | Printed-circuit board and manufacturing method thereof | |
| JP2007095959A | Printed board and manufacturing method thereof | |
| JP2007073654A | Printed wiring board | |
| JP2006165299A | Method of manufacturing printed circuit board | |
| JP2005136179A | Printed circuit board | |
| JP2005044869A | Inspection method of printed wiring board |