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SUMITOMO METAL MINING PACKAGE

Overview
  • Total Patents
    41
About

SUMITOMO METAL MINING PACKAGE has a total of 41 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Japan, Republic of Korea and Taiwan. Its main competitors in its focus markets semiconductors and chemical engineering are STAR CLUSTER KK, PLANAR SEMICONDUCTOR INC and BROOKS CCS GMBH.

Patent filings in countries

World map showing SUMITOMO METAL MINING PACKAGEs patent filings in countries
# Country Total Patents
#1 Japan 36
#2 Republic of Korea 4
#3 Taiwan 1

Patent filings per year

Chart showing SUMITOMO METAL MINING PACKAGEs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Mikami Juntaro 6
#2 Shimoji Takumi 5
#3 Okano Katsuhiko 4
#4 Noguchi Haruo 3
#5 Hata Hiroki 3
#6 Katsume Ichiro 3
#7 Unno Hiroshi 3
#8 Matsumura Yoshiaki 3
#9 Inoue Yoshihiro 2
#10 Nakamura Shinichi 2

Latest patents

Publication Filing date Title
JP2009071066A Chip on film (cof) wiring substrate and manufacturing method of the same
JP2008311388A Blanking die for flexible substrate
JP2008306085A Manufacturing method of semiconductor device and substrate used for manufacturing semiconductor device
JP2008305895A Manufacturing method of semiconductor mounting substrate
JP2008288273A Wiring substrate for cof (chip on film), manufacturing metod of the same, and semiconductor device
JP2008279608A Suction holder of screen printing machine for tab tape
JP2008270411A Method of manufacturing double-sided wiring tape carrier and tape carrier manufactured thereby
JP2008270265A Substrate for semiconductor device and its production process
JP2008263018A Substrate for semiconductor device and semiconductor device
JP2008263026A Cof wiring substrate and its manufacturing method
JP2008205141A Wiring board for cof, manufacturing method thereof and cof
JP2008205142A Wiring board for cof, manufacturing method thereof and semiconductor device
JP2008198727A Lead frame and its manufacturing method
JP2008132518A Guide tool
JP2008070446A System for stripping and recovering resist, and resist separation device and resist recovery tank used for the system
JP2008028154A Lead frame for optical semiconductor device
JP2008006324A Surface cleaning device
JP2007189114A Semiconductor mounting substrate and method of manufacturing same
JP2007109823A Flexible wiring board and method of manufacturing same
JP2007103450A Wiring board and method of manufacturing same