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ACM RES (SHANGHAI) INC

Overview
  • Total Patents
    112
  • GoodIP Patent Rank
    13,523
  • Filing trend
    ⇩ 100.0%
About

ACM RES (SHANGHAI) INC has a total of 112 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2012. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets semiconductors, chemical engineering and control are PLANAR SEMICONDUCTOR INC, XI AN WEIZHENG ELECTRONIC SCIENCE & TECHNOLOGY CO LTD and ACM RES SHANGHAI INC.

Patent filings in countries

World map showing ACM RES (SHANGHAI) INCs patent filings in countries

Patent filings per year

Chart showing ACM RES (SHANGHAI) INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Hui 110
#2 Wang Jian 88
#3 Jin Yinuo 40
#4 Jia Zhaowei 36
#5 Chen Fuping 22
#6 Wang Xi 21
#7 Wu Jun 19
#8 Dai Yingwei 16
#9 Zhang Xiaoyan 15
#10 Yang Guipu 14

Latest patents

Publication Filing date Title
JP2017166072A Device and method for plating and/or polishing wafer
TW201737330A Removing method of barrier layer and forming method of semiconductor structure utilizing heat flow etching method to remove barrier layer containing ruthenium or cobalt layer on non-recessed area of semiconductor structure
WO2017156758A1 Substrate heat treatment apparatus
TW201731596A Method and apparatus for cleaning semiconductor substrate capable of maintaining a stable bubble oscillation to achieve not damaging the patterned structure on the semiconductor substrate
WO2017096553A1 Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device
WO2017070924A1 Method for electrochemical polish in constant voltage mode
CN106571332A Interconnection structure processing method
CN106567130A Method for improving roughness of wafers
CN106558519A Whether wafer bearing device and inspection wafer place stable method
CN106555221A Ejecting device
WO2017024540A1 Method for processing interconnection structure for minimizing barrier sidewall recess
CN106373906A Semiconductor reaction cavity
CN106340470A Wafer surface cleaning device and cleaning method
CN106695567A Flow compensation method
CN106346353A Wafer rotating chuck achieving optimization based on position of anode sprayer
CN106346354A Wafer rotating chuck optimized on basis of cathode spray head position change
CN106356282A Dry-process cleaning cavity and dry-process cleaning method
CN106328580A Vapor phase etching method of copper interconnection structure
CN106328558A Processing chamber
CN106298505A Lithographic method