|
CN101562161A
|
|
Conductive structure of chip
|
|
CN101540300A
|
|
Wafer encapsulation body
|
|
CN101399212A
|
|
The method for packing that crystal grain reconfigures
|
|
CN101315920A
|
|
Chip stack package structure and manufacture method thereof
|
|
CN101231988A
|
|
Circuit coiling tape of thin film crystal cover packaging and thin film crystal cover packaging construction thereof
|
|
CN101131980A
|
|
Wafer packaging construction and manufacture method thereof with array connecting pad
|
|
CN101131987A
|
|
Thin-film flip-chip packaging construction and multilayer circuit rewinding structure
|
|
CN101118861A
|
|
Chip packaging structure and manufacturing method therefor
|
|
CN101114627A
|
|
Chip architecture
|
|
CN101106119A
|
|
Encapsulation structure for preventing adhesive crystal glue from polluting wafer welding cushion
|
|
CN101064266A
|
|
Method for detecting package carrier and its apparatus
|
|
CN1949496A
|
|
Flexible substrate for packaging
|
|
CN1937221A
|
|
Stacking structure for semiconductor packaging assembly
|
|
CN1917157A
|
|
Packaging structure of bug-hole downwards wafer and manufacture method thereof
|
|
US6781392B1
|
|
Modularized probe card with compressible electrical connection device
|
