WINPAC INC has a total of 15 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Republic of Korea. Its main competitors in its focus markets semiconductors, measurement and chemical engineering are CHIPMOS TECHNOLOGIES LTD, UEHLING TRENT S and STMICROELECTRONICS SDN BHD.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 15 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Measurement | |
#3 | Chemical engineering |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Cleaning | |
#3 | Measuring electric variables |
# | Name | Total Patents |
---|---|---|
#1 | Kim Dong Gyu | 7 |
#2 | Kim Yun Shik | 7 |
#3 | Ha Sang Ok | 6 |
#4 | Kim Ji Yon | 5 |
#5 | Park Bum Wook | 5 |
#6 | Koh Kyung Hee | 2 |
#7 | Kim Kyung Il | 1 |
#8 | Yang Min Ho | 1 |
#9 | Kim Sung Jun | 1 |
#10 | Yoon Kong Soo | 1 |
Publication | Filing date | Title |
---|---|---|
KR20180005368A | Tester interface board capable of self-cleaning | |
KR101707805B1 | Reconstruction method of wafer | |
KR101565519B1 | Fbricating method of chip open molding package | |
KR20130126306A | Stacked semiconductor package | |
KR20130125965A | Stacked semiconductor package and fabrication method of the same | |
KR20120101887A | Package module | |
KR20120101886A | Package module | |
KR20120101885A | Package module | |
KR20120064225A | Semiconductor package | |
KR100818593B1 | Momory device | |
KR20060005722A | Multi chip package | |
KR20060005720A | Package for image sensor | |
KR20060005721A | Multi chip package | |
KR20050118833A | Package for image sensor | |
KR20050116760A | Package for image sensor |