|
EP3718959A1
|
|
An electronic device and corresponding manufacturing method
|
|
EP3718961A1
|
|
A method of manufacturing electronic devices and corresponding electronic device
|
|
US2019184579A1
|
|
Barrel cap attach trays
|
|
US2019157176A1
|
|
Semiconductor packages having dual encapsulation material
|
|
CN110329983A
|
|
Wafer-class encapsulation and corresponding manufacturing process for MEMS sensor device
|
|
US2015145077A1
|
|
Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
|
|
US2013032936A1
|
|
Package for a MEMS sensor and manufacturing process thereof
|
|
ITTO20120854A1
|
|
PERFORMED SURFACE MOUNTED CONTAINER FOR AN INTEGRATED SEMICONDUCTOR DEVICE, ITS ASSEMBLY AND MANUFACTURING PROCEDURE
|
|
US2013083501A1
|
|
Method for soldering a cap to a support layer
|
