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TOUCH MICRO SYSTEM TECH

Overview
  • Total Patents
    176
About

TOUCH MICRO SYSTEM TECH has a total of 176 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and optics are SENSONOR TECHNOLOGIES AS, UNITED MONOLITHIC SEMICONDUCTORS GMBH and SY SILICON TECH CO LTD.

Patent filings in countries

World map showing TOUCH MICRO SYSTEM TECHs patent filings in countries
# Country Total Patents
#1 Taiwan 75
#2 China 60
#3 United States 40
#4 Singapore 1

Patent filings per year

Chart showing TOUCH MICRO SYSTEM TECHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yang Chen-Hsiung 21
#2 Lin Hung-Yi 19
#3 Hongyi Lin 13
#4 Chenxiong Yang 12
#5 Shao Shih-Feng 11
#6 Kang Yu-Fu 10
#7 Huang Kuan-Jui 10
#8 Pan Chin-Chang 8
#9 Hongda Zhang 6
#10 Chen Ming-Fa 6

Latest patents

Publication Filing date Title
TW201400918A Phase modulation module and projector comprising the same
US2013043136A1 Method for making a planar coil
TW201344240A Annular structure and micro scanning mirror
TW201342497A Package structure and packaging method
TW201306407A Linear scan structure and laser designator using the same
TW201328961A Comb electrode structure
TW201218224A Planar coil and method of making the same
CN102442631A Micro-electromechanical device and composite base material used in one micro-electromechanical device
TW201216459A MEMS device and compound wafer for an MEMS device
TW201201944A Laser heating apparatus for metal eutectic bonding
TW201200905A Biaxial scanning mirror for image forming apparatus
TW201200906A Biaxial scanning mirror for image forming apparatus and method for operating the same
US2009267108A1 Method for making light emitting diode chip package
CN101728280A Encapsulation structure of light-emitting diode and preparation method thereof
TW201304115A Method of making light emitting diode package
CN101685783A Light emitting diode chip package structure and making method thereof
TW201013970A Light emitting diode chip package and method of making the same
TW201011868A Chip package structure and method of making the same
CN101618848A Torsion-type MEMS element
CN101618849A Method for adjusting resonant frequency of torsional micro electro-mechanical component