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QINGDAO GEER INTELLIGENT SENSOR CO LTD

Overview
  • Total Patents
    26
  • GoodIP Patent Rank
    63,333
About

QINGDAO GEER INTELLIGENT SENSOR CO LTD has a total of 26 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and audio-visual technology are STMICROELECTRONICS MALTA LTD, SEMICONDUCTOR MFG INTERNATIONAL CORPORATION and SILEX MICROSYSTEMS AB.

Patent filings in countries

World map showing QINGDAO GEER INTELLIGENT SENSOR CO LTDs patent filings in countries
# Country Total Patents
#1 China 26

Patent filings per year

Chart showing QINGDAO GEER INTELLIGENT SENSOR CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Dexin 22
#2 Qiu Wenrui 6
#3 Tao Yuan 6
#4 Wang Wentao 4
#5 Fang Huabin 4
#6 Liu Bing 4
#7 Xu Jian 4
#8 Wang Wei 3
#9 Fu Hui 2
#10 Li Chengxiang 2

Latest patents

Publication Filing date Title
CN111479380A Circuit board assembly, and method and device for detecting coding offset
CN111463190A Sensor, manufacturing method thereof and electronic device
CN111307366A Combined sensor, manufacturing method thereof and electronic device
CN111383927A Chip packaging structure and packaging method
CN111370395A Packaging structure and packaging method of heart rate module and wearable device
CN111383999A Sensor manufacturing method and sensor
CN111414326A Method for analyzing serial peripheral interface communication data, computing equipment and storage medium
CN111128968A Chip packaging structure
CN111081696A Semiconductor package and method of manufacturing the same
CN111071987A Packaging method and packaging structure of micro-electromechanical system sensor
CN111063665A Special-shaped TWS SIP module and manufacturing method thereof
CN111158738A Earphone firmware upgrading method and device and readable storage medium
CN111115556A Packaging method and packaging structure of micro-electro-mechanical system sensor
CN111128976A Chip stacking packaging heat dissipation structure and manufacturing method
CN111081655A Electronic packaging structure and manufacturing method thereof
CN110868682A MEMS microphone
CN110931449A Power module packaging structure and packaging method of power module
CN111079603A Step prediction method, controller, positioning device and readable storage medium
CN111107480A SIP module mounting structure and method of microphone
CN111059466A Nitrogen gas supply device, plasma cleaning system and nitrogen gas supply method