| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Australia | 20 | |
| #2 | United Kingdom | 1 | |
| #3 | United States | 1 | |
| #4 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machine tools | |
| #2 | Semiconductors | |
| #3 | Measurement | |
| #4 | Chemical engineering | |
| #5 | Basic materials chemistry | |
| #6 | Surface technology and coating | |
| #7 | Thermal processes | |
| #8 | Civil engineering |
| # | Name | Total Patents |
|---|---|---|
| #1 | Herb John D | 4 |
| #2 | Schultz Stephen C | 4 |
| #3 | Adams John A | 4 |
| #4 | Bibby Thomas Frederick Allen J | 3 |
| #5 | Chadda Saket | 2 |
| #6 | Meloni Mark A | 2 |
| #7 | Gromko Robert D | 2 |
| #8 | Barns Chris | 2 |
| #9 | Farmer James L | 2 |
| #10 | Lisi Edmund T | 2 |
| Publication | Filing date | Title |
|---|---|---|
| AU1143202A | Method and apparatus for electrochemical planarization of a workpiece | |
| AU4972401A | System and method for predicting software models using material-centric process instrumentation | |
| AU7851000A | Optimal offset, pad size and pad shape for cmp buffing and polishing | |
| US6238271B1 | Methods and apparatus for improved polishing of workpieces |