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TIANJIN HWATSING TECH CO LTD

Overview
  • Total Patents
    18
  • GoodIP Patent Rank
    92,045
  • Filing trend
    ⇩ 100.0%
About

TIANJIN HWATSING TECH CO LTD has a total of 18 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2016. It filed its patents most often in China. Its main competitors in its focus markets machine tools, semiconductors and optics are NIPPON SEIMITSU DENSHI CO LTD, HANGZHOU ZHONGGUI ELECTRONIC TECH CO LTD and DAITO ELECTRON CO LTD.

Patent filings in countries

World map showing TIANJIN HWATSING TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 18

Patent filings per year

Chart showing TIANJIN HWATSING TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lu Xinchun 14
#2 Shen Pan 13
#3 Jin Jun 5
#4 Zhao Huijia 4
#5 Li Hongkai 3
#6 Wang Tongqing 3
#7 Zhang Jingye 3
#8 Zhao Dewen 3
#9 Ma Haigang 2
#10 Chen Rui 2

Latest patents

Publication Filing date Title
CN110561201A Method for controlling polishing process and chemical mechanical polishing device
CN110977772A Trimming head
CN110970323A Substrate processing device and processing system
CN110962037A Bearing head and chemical mechanical polishing device
CN110948385A Elastic membrane for chemical mechanical polishing
CN107378747A CMP process for MEMS
CN107243826A The method for adjusting wafer film thickness uniformity after CMP
CN107225436A Polissoir and its polishing method
CN107309710A Polishing method
CN107127679A Device for installing polishing pad
CN107309782A The detection method and detection means of moment of torsion terminal
CN107195547A In the method for improved wire flatness of wafer surface
CN107214610A The online flatness control system of copper CMP
CN107024737A Lens group device
CN107180751A Handle the control method of crystal column surface
CN107030583A Silicon substrate film polishing method and device
CN106956218A For the liquid feed device in polissoir
CN106409713A Online calculation method for multi-point measurement of thickness of copper layer on surface of wafer