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HWATSING CO LTD

Overview
  • Total Patents
    23
  • GoodIP Patent Rank
    70,235
About

HWATSING CO LTD has a total of 23 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets machine tools, semiconductors and chemical engineering are WESTECH SYSTEMS INC, CALITECH CO LTD and NIPPON SEIMITSU DENSHI CO LTD.

Patent filings in countries

World map showing HWATSING CO LTDs patent filings in countries
# Country Total Patents
#1 China 23

Patent filings per year

Chart showing HWATSING CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhao Dewen 17
#2 Liu Yuanhang 10
#3 Xu Zhenjie 8
#4 Wang Jiangtao 6
#5 Lu Xinchun 5
#6 Ma Xu 5
#7 Meng Songlin 5
#8 Zhao Huijia 3
#9 Li Changkun 3
#10 Wang Yu 3

Latest patents

Publication Filing date Title
CN112207655A Wafer grinding equipment with mobile manipulator
CN112201606A Wafer centering mechanism with flexible coupling, transmission device and thinning equipment
CN112201607A Wafer centering mechanism, wafer transmission device and wafer thinning equipment
CN112059914A Slip sheet detection device and chemical mechanical polishing system
CN112090217A Water-gas separation device and chemical mechanical polishing system
CN112096740A Air supply system for air bearing and grinding tool
CN112071797A Vacuum chuck system for wafer loading
CN112045548A Wafer bearing device for chemical mechanical polishing and chemical mechanical polishing equipment
CN111843823A Spindle assembly
CN111823134A Spindle assembly, spindle mounting base, substrate grinding equipment and spindle dismounting method
CN111785663A Wafer post-processing system
CN111780537A Marangoni drying device applied to wafer post-processing
CN111673644A Device and method for testing rigidity of grinding spindle
CN111633532A Substrate thinning equipment with chemical mechanical polishing unit
CN111633531A Thinning equipment with single-cavity cleaning device
CN111554569A Wafer cleaning device and wafer cleaning method
CN111524833A Chemical mechanical polishing system and chemical mechanical polishing method
CN111496665A Chemical mechanical polishing control method and control system
CN111469045A Wafer loading cup
CN111469046A Wafer loading cup