OPTOPAC INC has a total of 19 patent applications. Its first patent ever was published in 2003. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets semiconductors and audio-visual technology are KOYANAGI MITSUMASA, GRAPHIC TECHNO JAPAN CO LTD and IXELON CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 9 | |
#2 | WIPO (World Intellectual Property Organization) | 6 | |
#3 | Taiwan | 2 | |
#4 | China | 1 | |
#5 | Japan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Television |
# | Name | Total Patents |
---|---|---|
#1 | Kim Deok Hoon | 10 |
#2 | Kim Deok-Hoon | 8 |
#3 | Reche John J H | 4 |
#4 | Lee Hwan Chul | 2 |
#5 | Lee Hwan-Chul | 2 |
Publication | Filing date | Title |
---|---|---|
TW200618220A | Method of making camera module in wafer level | |
US2005224938A1 | Electronic package having a sealing structure on predetermined area, and the method thereof | |
US6943424B1 | Electronic package having a patterned layer on backside of its substrate, and the fabrication thereof | |
US6943423B2 | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof | |
US6864116B1 | Electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |