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SILICONWARE PRECISION INDUSTRIES CO LTD

Overview
  • Total Patents
    2,853
  • GoodIP Patent Rank
    1,530
  • Filing trend
    ⇩ 46.0%
About

SILICONWARE PRECISION INDUSTRIES CO LTD has a total of 2,853 patent applications. It decreased the IP activity by 46.0%. Its first patent ever was published in 1997. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors, audio-visual technology and telecommunications are ZHAO SAM ZIQUN, ADVANCED SEMICONDUCTOR ENG and HUATONG COMPUTER CO LTD.

Patent filings in countries

World map showing SILICONWARE PRECISION INDUSTRIES CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 1,273
#2 United States 857
#3 China 722
#4 Japan 1

Patent filings per year

Chart showing SILICONWARE PRECISION INDUSTRIES CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Chien-Ping 337
#2 Hsiao Cheng-Hsu 152
#3 Huang Chih-Ming 111
#4 Pu Han-Ping 108
#5 Huang Chien Ping 99
#6 Lin Chang-Fu 96
#7 Chiu Chih-Hsien 83
#8 Huang Jian-Ping 82
#9 Tsai Ho-Yi 74
#10 Jianping Huang 69

Latest patents

Publication Filing date Title
TWI710099B Packaging structure and method for fabricating the same
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US10863626B1 Electronic package carrier structure thereof, and method for fabricating the carrier structure
TWI713190B Electronic package and method for fabricating the same
US2021067982A1 Automated antenna testing device
US2021051800A1 Electronic package, assemble substrate, and method for fabricating the assemble substrate
TWI714269B Electronic package and method for manufacturing the same
TWI712135B Electronic package and manufacturing method thereof
TWI700801B Electronic package and method for manufacturing the same
TWI710094B Electronic package and method of manufacture
TWI693414B Inspection equipment and testing device thereof
TWI706523B Electronic package
TWI700780B Electronic package and method for fabricating the same
CN112234044A Electronic package, conductive substrate thereof and manufacturing method thereof
TWI712149B Electronic package and method for fabricating the same
TWI703615B Method for fabricating electronic package