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VINCENT MICHAEL B

Overview
  • Total Patents
    14
  • GoodIP Patent Rank
    179,421
About

VINCENT MICHAEL B has a total of 14 patent applications. Its first patent ever was published in 2012. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are CORISIS DAVID J, NALLA RAVI K and TAIWAN SEMICONDUCTOR MANFACTUR.

Patent filings in countries

World map showing VINCENT MICHAEL Bs patent filings in countries
# Country Total Patents
#1 United States 14

Patent filings per year

Chart showing VINCENT MICHAEL Bs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Vincent Michael B 14
#2 Hayes Scott M 6
#3 Gong Zhiwei 6
#4 Wright Jason R 4
#5 Yap Weng F 2
#6 Mitchell Douglas G 2
#7 Pabst Eduard J 1
#8 Magnus Alan J 1
#9 Duong Trung Q 1

Latest patents

Publication Filing date Title
US2015243635A1 Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
US2016099212A1 Through package circuit in fan-out wafer level package
US2016073496A1 Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereof
US2016013076A1 Three dimensional package assemblies and methods for the production thereof
US2015380386A1 Microelectronic packages having embedded sidewall substrates and methods for the producing thereof
US2015348865A1 Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof
US2015270233A1 Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers
US2015262931A1 Microelectronic packages having mold-embedded traces and methods for the production thereof
US2015162309A1 Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication
US2015162310A1 Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication
US2015108661A1 Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereof
US2015092372A1 Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication
US2014070415A1 Microelectronic packages having trench vias and methods for the manufacture thereof
US2013215583A1 Embedded electrical component surface interconnect