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High density module card, substrate and fabrication for the same
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Structure of a substrate for a high density semiconductor package
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Low cost method of testing a cavity-up BGA substrate
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Quick turn around fabrication process for packaging substrates and high density cards
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Low cost high density thin film processing
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Low cost decal material used for packaging
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BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology
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High density wire bond BGA
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High density flip chip BGA
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