Learn more

HUATONG COMPUTER CO LTD

Overview
  • Total Patents
    43
About

HUATONG COMPUTER CO LTD has a total of 43 patent applications. Its first patent ever was published in 1990. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and audio-visual technology are TAIWAN SEMICONDUCTOR MANFACTUR, OHKUCHI MAT CO LTD and SHIM IL KWON.

Patent filings in countries

World map showing HUATONG COMPUTER CO LTDs patent filings in countries
# Country Total Patents
#1 China 43

Patent filings per year

Chart showing HUATONG COMPUTER CO LTDs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Lin Dinghao 9
#2 Lin Wenyan 5
#3 Cai Weiren 5
#4 Huang Shiting 5
#5 Huang Dechang 2
#6 Zhong Wenlong 2
#7 Lin Chengyuan Huang 2
#8 Jiahua Bai 2
#9 Mingzhe Chen 1
#10 Zheng Shengquan 1

Latest patents

Publication Filing date Title
CN101090606A Manufacturing method of circuit board
CN101090604A Circuit board with honeycomb resin discharge channel
CN101022696A Multilayer circuit board with net grounded side characteristic impedance control method and structure
CN1816258A Method for making hard-soft composite circuit board
CN1753602A Method of adding welding convex block on circuit board
CN1744798A Method for forming projection of welding on circuit board
CN1616172A Method for producing blind hole on multiple layer base plate and automatic drilling machine for realizing said method
CN1592545A Method for mfg. printed circuitboard
CN1548208A Filtering machine
CN1457227A Target position producing method by double or above pressed printing circuit boards
CN1446039A Solder paste print deice for remnant stannum easy to be shed-off
CN1444433A Production method of printed circuit borad with built-in resistor
CN1434673A Tinol printer capable of being beneficial to tinol actively separating
CN1416312A Method for producing printed circuit board with multiple layers and mfg tool thereof
CN1392418A Detection method for missing curcuit board wire
CN1392758A Method for forming high density super fine circuiton fibrous substrate
CN1344131A Laser perforation method for PCB and substrate
CN1333558A Pin package method for pin gate assembly
CN1294412A Plastic substrate with heat dissipation function for package and its making method
CN1294483A Plastic substrate containing metal frame for package and its making method