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SICHUAN LIPTAI ELECTRONIC CO LTD

Overview
  • Total Patents
    13
  • GoodIP Patent Rank
    155,182
About

SICHUAN LIPTAI ELECTRONIC CO LTD has a total of 13 patent applications. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, measurement and macromolecular chemistry and polymers are CHO ONPA KOGYO CO, SAINEKKUSU KK and MICRON PREC CO LTD.

Patent filings in countries

World map showing SICHUAN LIPTAI ELECTRONIC CO LTDs patent filings in countries
# Country Total Patents
#1 China 13

Patent filings per year

Chart showing SICHUAN LIPTAI ELECTRONIC CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Cai Shaofeng 11
#2 Li Ke 10
#3 Chen Fengfu 9
#4 Deng Bo 8
#5 He Yong 6
#6 Pu Junde 6
#7 Li Li 6
#8 Gao Wei 4
#9 Ren Min 4
#10 Yang Hongwei 3

Latest patents

Publication Filing date Title
CN112098799A Alternating current dynamic parameter test calibration device and method for MOSFET device
CN112002647A Automatic pin cutting and testing integrated machine for semiconductor electronic device and application thereof
CN111999630A Method and system for testing working junction temperature of power device
CN111554677A Power device terminal structure with low electromagnetic interference
CN110809339A Heating device and heating control system for testing high-temperature parameters of power device
CN110808245A Low electromagnetic interference power device terminal structure
CN110854072A Manufacturing process of low electromagnetic interference power device terminal structure
CN110774528A Plastic packaging process for low-stress high-thermal-conductivity device
CN110504182A A kind of wire bonding reliability detection system and method
CN109900634A A kind of lead key closing process monitoring reliability method
CN109713041A A kind of structure-improved suitable for superjunction DMOS device
CN102723314A Insulation TO220AB power device based on aluminum radiating fin and production method
CN102637613A Realization method for lead bonding thick aluminum wire