Method and apparatus for partially encapsulating semiconductor chips
NL1011929C2
Method for encapsulating electronic components, in particular integrated circuits.
WO9954110A1
Packaging for encapsulating material
NL1011391C2
Composite material comprising a thermally unstable component dissolved in a thermoplastic, made by dissolving the thermoplastic in a reactive solvent and dissolving the thermally unstable component in the resulting mixture
NL1011392C2
Mould tool for encapsulating electronic components, especially integrated circuits, contains replaceable product dependent mould cavity material sections
NL1010862C2
Packaging system for integrated circuits and other electronic components, involves cells for individual components formed from plastic foil in vacuum sealing machine
NL1010567C2
Machine for packaging integrated circuits and other electronic components as micropellets in ball-grid arrays uses balanced fill encapsulation method
NL1010503C2
Packaging for encapsulating electronic components by transfer molding
NL1008924C2
Packaging for encapsulating electronic components by transfer molding
NL1008565C2
Mold used for encapsulating electronic components by transfer molding process
NL1005339C2
Feed device, particularly for transfer-moulding unit
NL1005283C2
Matrix assembly comprising two parts movable in relation to each other for determining at least one shaped cavity
HK71096A
Method for packing a measured quantity of thermosetting resin intended for encapsulating a componentpacking obtained using this method method for operating a mould and mould for carrying out this method
NL1000777C2
Method of encapsulating an electronic component, electronic component suitable for use in performing this method and encapsulated component obtained using the method.
NL1000621C2
Encapsulation of electronic components, e.g. integrated circuits
NL9402233A
Method for encapsulating an electronic component, an electronic component thus encapsulated and plastic material intended therefor.
NL9400119A
Method for encapsulating an electronic component with a hardening plastic, electronic components with plastic enclosure obtained by means of this method and mold for carrying out the method.
SG73416A1
Method for pressing a plastic which cures by means of a reaction into a mould cavity a pressing auxiliary in pill form to be used in this method and a holder composed of such material
