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FUJITSU MIYAGI ELECTRON KK

Overview
  • Total Patents
    220
About

FUJITSU MIYAGI ELECTRON KK has a total of 220 patent applications. Its first patent ever was published in 1987. It filed its patents most often in Japan and United States. Its main competitors in its focus markets semiconductors, machines and audio-visual technology are TRIMECS CO LTD, MICRON PREC CO LTD and SAINEKKUSU KK.

Patent filings in countries

World map showing FUJITSU MIYAGI ELECTRON KKs patent filings in countries
# Country Total Patents
#1 Japan 219
#2 United States 1

Patent filings per year

Chart showing FUJITSU MIYAGI ELECTRON KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Asano Yuichi 46
#2 Kobayashi Hitoshi 42
#3 Takahashi Fumihito 31
#4 Sekiba Takashi 26
#5 Kobayashi Kenji 25
#6 Okuyama Shigenori 20
#7 Sakuranaka Hiroyuki 18
#8 Saito Daiichi 17
#9 Kudo Osamu 14
#10 Suzuki Yusuke 14

Latest patents

Publication Filing date Title
JPH07254658A Semiconductor device and carrier therefor
JPH07249723A Method and structure for mounting semiconductor device and lead frame
JPH07244118A Container for semiconductor device, method and apparatus for testing semiconductor
JPH07176561A Wire bonder
JPH07174817A Ic carrier
JPH07169782A Die bonding method
JPH07169798A Method and apparatus for wire bonding
JPH07170094A Housing tray of electronic-element chip
JPH07156157A Method and apparatus for cleaning resin mold
JPH07153827A Protective carrier of electronic parts
JPH07153865A Semiconductor device
JPH07153892A Lead frame
JPH07153891A Manufacture of electronic part and punching device used therein
JPH07115160A Lead frame and semiconductor device
JPH07106035A Ic carrier
JPH07111305A Manufacture of semiconductor device, metal support frame and mold used therefor
JPH07103203A Fluid speed controller
JPH0786312A Lead frame separating method, lead frame separator and die bonder
JPH0786321A Method for assembling semiconductor device
JPH0752188A Manufacture of molding die and semiconductor device